Datasheet

ADA4830-1 Data Sheet
Rev. 0 | Page 16 of 16
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
Figure 29.8-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-8-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding Ordering Quantity
ADA4830-1BCPZ-R7 −40°C to +125°C 8-Lead Lead Frame Chip
Scale Package [LFCSP]
CP-8-11 H30 1,500
ADA4830-1BCPZ-R2 −40°C to +125°C 8-Lead Lead Frame Chip
Scale Package [LFCSP]
CP-8-11 H30 250
ADA4830-1BCP-EBZ Evaluation Board
1
Z = RoHS Compliant Part.
2.44
2.34
2.24
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.70
1.60
1.50
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT TO
JEDEC STANDARDS MO-229-WEED
01-24-2011-B
©2011
Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10020-0-10/11(0)
www.analog.com/ADA4830-1