Datasheet

ADA4817-1/ADA4817-2 Data Sheet
Rev. B | Page 24 of 28
OUTLINE DIMENSIONS
1
EXPOSED
PA D
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-04-2012-A
Figure 58. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead (CP-8-2)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-012-AA
06-02-2011-B
1.27
0.40
1.75
1.35
2.29
2.29
0.356
0.457
4.00
3.90
3.80
6.20
6.00
5.80
5.00
4.90
4.80
0.10 MAX
0.05 NOM
3.81 REF
0.25
0.17
8°
0°
0.50
0.25
45°
COPLANARITY
0.10
1.04 REF
8
1
4
5
1.27 BSC
S
EATING
PLANE
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
TOP VIEW
0.51
0.31
1.65
1.25
Figure 59. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]
(RD-8-1)
Dimensions shown in millimeters and (inches)