Datasheet

ADA4691-2/ADA4691-4/ADA4692-2/ADA4692-4
Rev. C | Page 17 of 20
OUTLINE DIMENSIONS
3.10
3.00 SQ
2.90
0.30
0.23
0.18
1.75
1.60 SQ
1.55
070209-C
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
COMPLIANT TO JEDEC STANDARDS MO-220-WEED.
Figure 62. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-22)
Dimensions shown in millimeters
0
91709-A
1.250
1.210
1.170
0.645
0.600
0.555
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
123
B
C
0.230
0.200
0.170
0.287
0.267
0.247
SEATING
PLANE
0.415
0.400
0.385
BALL A1
IDENTIFIER
1.260
1.220
1.180
0.05 NOM
COPLANARITY
0.40
BSC
Figure 63. 9-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-9-3)
Dimensions shown in millimeters