Datasheet

ADA4691-2/ADA4691-4/ADA4692-2/ADA4692-4
Rev. C | Page 7 of 20
PIN CONFIGURATIONS
ADA4691-2
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
07950-058
BALL A1
CORNER
A1
OUT B V+ OUT A
–IN B SD A/B –IN A
+IN B V– +IN A
B1
C1
A2
B2
C2
A3
B3
C3
Figure 3. 9-Ball Wafer Level Chip Scale WLCSP (CB-9-3)
07950-002
6
7
2
1
3
+IN
A
–IN A
V–
8
+IN B
–IN B
OUT B
5
SD B
4
SD A
TOP VIEW
(Not to Scale)
ADA4691-2
10
9
OUT
A
V+
Figure 4. 10-Lead, 2 mm × 2 mm LFCSP (CP-10-11)
07950-060
12
11
10
1
3
4
+IN D
V–
+IN C
9
–IN C
+IN A
+IN B
2
V+
–IN B
6
SD
A/B
5
OUT B
7
SD C/D
8
OUT C
16
–IN A
15
OUT A
14
OUT D
13
–IN D
ADA4691-4
TOP VIEW
(Not to Scale)
NOTES
1. IT IS RECOMMENDED THAT THE EXPOSED
PAD BE CONNCECTED TO V–.
Figure 5. 16-Lead, 3 mm × 3 mm LFCSP (CP-16-22)
TOP VIEW
(Not to Scale)
ADA4692-2
3+IN A
4V–
1OUT A
2–IN A
6 –IN B
5 +IN B
8V+
7OUT B
07950-016
Figure 6. 8-Lead, 2 mm × 2 mm LFCSP (CP-8-6)
OUT A 1
–IN 2
+IN 3
V– 4
V+ 8
OUT B 7
–IN B 6
+IN B 5
ADA4692-2
TOP VIEW
(Not to Scale)
07950-001
Figure 7. 8-Lead SOIC_N (R-8)
07950-059
1
2
3
4
5
6
7
ADA4692-4
–IN A
+IN A
V+
OUT B
–IN B
+IN B
OUT A
14
13
12
11
10
9
8
–IN D
+IN D
V–
OUT C
–IN C
+IN C
OUT D
TOP VIEW
(Not to Scale)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
TOP VIEW
(Not to Scale)
Figure 8. 14-Lead TSSOP (RU-14)