Datasheet

ADA4638-1 Data Sheet
Rev. 0 | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 5.
Parameter Rating
Supply Voltage 33 V
Input Voltage
1
±V
SY
Input Current ±10 mA
Differential Input Voltage ±V
SY
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Junction Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
θ
JA
is specified for a device soldered on a 4-layer JEDEC
standard board with zero airflow. For LFCSP packages, the
exposed pad is soldered to the board.
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
8-Lead SOIC 120 45 °C/W
8-Lead LFCSP 75 12 °C/W
ESD CAUTION
1
Input voltage should always be limited to less than 30 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.