Datasheet

Data Sheet ADA4638-1
Rev. 0 | Page 21 of 24
OUTLINE DIMENSIONS
2.44
2.34
2.24
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.70
1.60
1.50
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
01-24-2011-B
Figure 69. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-11)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 70. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADA4638-1ACPZ-R7 −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-8-11 A2W
ADA4638-1ACPZ-RL −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-8-11 A2W
ADA4638-1ARZ −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADA4638-1ARZ-R7 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADA4638-1ARZ-RL −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
1
Z = RoHS Compliant Part.