Datasheet

ADA4505-1/ADA4505-2/ADA4505-4
Rev. D | Page 20 of 24
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 63. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
061208-A
A
B
C
D
E
0.650
0.595
0.540
1.50
1.46
1.42
3.00
2.96
2.92
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.340
0.320
0.300
2.00
BSC
BALL 1
IDENTIFIER
SEATING
PLANE
1.00
BSC
0.50
BSC
0.50 BSC
0.25
BSC
0.25
BSC
0.25
BSC
0.25
BSC
0.50 BSC
0.50 BSC
0.380
0.355
0.330
0.270
0.240
0.210
0.10 MAX
COPLANARITY
Figure 64. 14-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-14-1)
Dimensions shown in millimeters