Datasheet

ADA4505-1/ADA4505-2/ADA4505-4
Rev. D | Page 19 of 24
011008-B
SEATING
PLANE
0.50
BALL PITCH
1.460
1.420 SQ
1.380
0.270
0.240
0.210
0.380
0.355
0.330
0.340
0.320
0.300
0.650
0.595
0.540
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
A
123
B
C
BALL 1
IDENTIFIER
COPLANARITY
0.075
Figure 61. 8-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-8-2)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-AA
100709-B
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 62. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters