Datasheet

ADA4500-2 Data Sheet
Rev. A | Page 24 of 24
OUTLINE DIMENSIONS
TO
P
VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
ARE
A
SEATING
PLANE
0.80
0.75
0.70
1.70
1.60 SQ
1.50
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT
TO
JEDEC STANDARDS MO-229-WEED
07-06-2011-A
PIN 1
INDIC
A
T
OR
(R 0.15)
Figure 67. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very, Very Thin, Dual Lead
(CP-8-12)
Dimensions shown in millimeters
C
OM
P
LI
ANT TO JEDEC STANDARDS MO
-18
7-A
A
6°
0°
0.80
0.55
0.40
4
8
1
5
0.
65 B
SC
0.4
0
0.2
5
1.
1
0 M
AX
3.
20
3
.00
2
.80
COPLANARITY
0.
10
0.
2
3
0
.09
3
.
20
3
.0
0
2.
8
0
5.15
4.90
4
.
65
PIN
1
IDENTIFIER
15° MAX
0.
9
5
0.
8
5
0.
75
0.15
0.05
1
0-
0
7-
20
09-
B
Figure 68. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Package Description Package Option Branding
ADA4500-2ACPZ-R7 −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-8-12 A2Z
ADA4500-2ACPZ-RL −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-8-12 A2Z
ADA4500-2ARMZ −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 A2Z
ADA4500-2ARMZ-R7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 A2Z
ADA4500-2ARMZ-RL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 A2Z
1
Z = RoHS Compliant Part.
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D10617-0-10/12(A)