Datasheet

Data Sheet ADA4433-1
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage 4 V
Output Common-Mode Voltage 22 V
Input Differential Voltage +V
S
Power Dissipation See Figure 2
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +125°C
Lead Temperature (Soldering, 10 sec) 260°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the device soldered to a high thermal
conductivity 4-layer (2s2p) circuit board, as described in
EIA/JESD 51-7.
Table 3.
Package Type θ
JA
θ
JC
Unit
8-Lead LFCSP 50 5 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4433-1 package
is limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Exceeding a
junction temperature of 150°C for an extended time can result
in changes in the silicon devices, potentially causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
S
) times the
quiescent current (I
S
). The power dissipated due to the load
drive depends on the particular application. For each output,
the power due to load drive is calculated by multiplying the load
current by the associated voltage drop across the device. The
power dissipated due to the loads is equal to the sum of the
power dissipations due to each individual load. RMS voltages
and currents must be used in these calculations.
Airflow increases heat dissipation, effectively reducing θ
JA
. Figure 2
shows the maximum power dissipation in the package vs. the
ambient temperature for the 8-lead LFCSP (50°C/W) on a JEDEC
standard 4-layer board. θ
JA
values are approximate.
Figure 2. Maximum Power Dissipation vs.
Ambient Temperature for a 4-Layer Board
ESD CAUTION
0
1
2
3
4
5
–40 –20 0 20 40 60 80 100 120
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (ºC)
T
J
= 150°C
LFCSP
10597-003