Datasheet

ADA4432-1/ADA4433-1 Data Sheet
Rev. A | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage 4 V
Output Common-Mode Voltage 22 V
Input Differential Voltage +V
S
Power Dissipation See Figure 3
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +125°C
Lead Temperature (Soldering, 10 sec) 260°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the device soldered to a high thermal
conductivity 4-layer (2s2p) circuit board, as described in
EIA/JESD 51-7.
Table 4.
Package Type θ
JA
θ
JC
Unit
6-Lead SOT-23 170 Not applicable °C/W
8-Lead LFCSP 50 5 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4432-1 and
ADA4433-1 packages are limited by the associated rise in
junction temperature (T
J
) on the die. At approximately 150°C,
which is the glass transition temperature, the plastic changes its
properties. Exceeding a junction temperature of 150°C for an
extended time can result in changes in the silicon devices,
potentially causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
S
) times the
quiescent current (I
S
). The power dissipated due to the load drive
depends on the particular application. For each output, the
power due to load drive is calculated by multiplying the load
current by the associated voltage drop across the device. The
power dissipated due to the loads is equal to the sum of the
power dissipations due to each individual load. RMS voltages
and currents must be used in these calculations.
Airflow increases heat dissipation, effectively reducing θ
JA
.
Figure 3 shows the maximum power dissipation in the package
vs. the ambient temperature for the 6-lead SOT-23 (170°C/W)
and the 8-lead LFCSP (50°C/W) on a JEDEC standard 4-layer
board. θ
JA
values are approximate.
Figure 3. Maximum Power Dissipation vs.
Ambient Temperature for a 4-Layer Board
ESD CAUTION
0
1
2
3
4
5
–40 –20 0 20 40 60 80 100 120
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (ºC)
T
J
= 150°C
LFCSP
SOT-23
10597-003