Datasheet

ADA4312-1 Data Sheet
Rev. 0 | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage, V
CC
13.2 V
SD Voltage
V
CC
Power Dissipation 1.25 W
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The thermal resistance (θ
JA
) was specified using the ADA4312-1
evaluation board (EVAL -ADA4312-1ACPZ).
Table 3.
Package Type
θ
JA
Unit
16-Lead LFCSP_WQ 31.8 °C/W
MAXIMUM POWER DISSIPATION
Exceeding a junction temperature of 150°C can result in changes
to silicon devices, potentially causing degradation or loss of
functionality.
The power dissipation of the ADA4312-1 is 750 mW for a typical
G.hn application delivering 16 dBm into a 40 Ω differential load.
The maximum internal power dissipation should not exceed
1.25 W over the extended industrial temperature range of −40°C
to +85°C on a PCB designed according to the guidelines in the
Thermal Management section.
ESD CAUTION