Datasheet

ADA4310-1
Rev. 0 | Page 13 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-BA-T
0.23
0.08
0.80
0.60
0.40
8°
0°
0.15
0.00
0.33
0.17
0.95
0.85
0.75
SEATING
PLANE
1.10 MAX
10
6
5
1
0.50 BSC
3.00 BSC
3.00 BSC
4.90 BSC
PIN 1
COPLANARITY
0.10
TOP
VIEW
BOTTOM VIEW
EXPOSED
PAD
SQ
2.50
0.75
Figure 22. 10-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP]
(RH-10)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
2
.
2
5
2
.
1
0
S
Q
1
.
9
5
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
EXPOSED
PA D
(BOTTOM VIEW)
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
0.25 MIN
010606-0
0.75
0.60
0.50
Figure 23. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature
Package
Package Description
Package
Option
Branding
ADA4310-1ARHZ-RL
1
−40°C to +85°C 10-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] RH-10 0L
ADA4310-1ARHZ-R7
1
−40°C to +85°C 10-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] RH-10 0L
ADA4310-1ARHZ
1
−40°C to +85°C 10-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] RH-10 0L
ADA4310-1ACPZ-RL
1
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
ADA4310-1ACPZ-R2
1
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
ADA4310-1ACPZ-R7
1
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
1
Z = Pb-free part.