Datasheet

ADA4096-2/ADA4096-4 Data Sheet
Rev. D | Page 22 of 24
Figure 59. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
Figure 60. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-27)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SE
ATING
PLANE
3.10
3.00 SQ
2.90
0.30
0.25
0.20
1.65
1.50 SQ
1.45
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.80
0.75
0.70
COMPLIANT TO
JEDEC STANDARDS MO-220-WEED-6.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
01-26-2012-A