Datasheet

Data Sheet ADA4084-1/ADA4084-2/ADA4084-4
Rev. I | Page 35 of 36
2.70
2.60 SQ
2.50
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGC.
1
0.65
BSC
16
5
8
9
12
13
4
4.10
4.00 SQ
3.90
0.45
0.40
0.35
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
BOTTOM VIEW
PKG-004828
SEATING
PLANE
TOP VIEW
SIDE VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
02-22-2017-C
1
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
EXPOSED
PAD
F
igure 119. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 075 mm Package Height
(CP-16-17)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
F
igure 120. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
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