Datasheet

ADA4051-1/ADA4051-2
Rev. B | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
Parameter Rating
Supply Voltage 6 V
Input Voltage ±V
SY
± 0.3 V
Input Current
1
±10 mA
Differential Input Voltage
2
±V
SY
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Junction Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
θ
JA
is specified for the worst-case conditions, that is, a device
soldered on a circuit board for surface-mount packages with its
exposed paddle soldered to a pad, if applicable. Table 5 shows
simulated thermal values for a 4-layer (2S2P) JEDEC standard
thermal test board, unless otherwise specified.
Table 5. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
5-Lead SOT-23 (RJ-5) 190 92 °C/W
5-Lead SC-70 (KS-5) 534 173 °C/W
8-Lead MSOP (RM-8) 142 45 °C/W
8-Lead LFCSP (CP-8-2) 77 14 °C/W
1
The input pins have clamp diodes to the power supply pins. Limit the input
current to 10 mA or less whenever input signals exceed the power supply
rail by 0.3 V.
POWER SEQUENCING
2
Inputs are protected against high differential voltages by internal series
1.33 kΩ resistors and back-to-back diode-connected N-MOSFETs (with a
typical V
T
of 0.7 V for V
CM
of 0 V).
The op amp supplies must be established simultaneously with
or before any input signals are applied. If this is not possible, the
input current must be limited to 10 mA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION