Datasheet

AD9979
Rev. C | Page 7 of 56
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
With
Respect To Rating
AVDD AVSS −0.3 V to +2.2 V
DVDD DVSS −0.3 V to +2.2 V
DRVDD DRVSS −0.3 V to +3.9 V
IOVDD DVSS −0.3 V to +3.9 V
HVDD HVSS −0.3 V to +3.9 V
RGVDD RGVSS −0.3 V to +3.9 V
Any VSS Any VSS −0.3 V to +0.3 V
RG Output RGVSS −0.3 V to RGVDD + 0.3 V
H1 to H4, HL Output HVSS −0.3 V to HVDD + 0.3 V
SCK, SL, SDI DVSS −0.3 V to IOVDD + 0.3 V
REFT, REFB, CCDINM,
CCDINP
AVSS −0.2 V to AVDD + 0.2 V
Junction Temperature 150°C
Lead Temperature (10 sec) 350°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is measured using a 4-layer printed circuit board (PCB) with
the exposed paddle soldered to the board.
Table 6.
Package Type θ
JA
Unit
48-Lead, 7 mm × 7 mm LFCSP 25.8 °C/W
ESD CAUTION