Datasheet

AD9974
Rev. A | Page 50 of 52
OUTLINE DIMENSIONS
B
C
D
E
F
G
H
J
K
A
SEATING
PLANE
0.25 MIN
DETAIL A
0.55
0.50
0.45
BALL DIAMETER
COPLANARITY
0.12
0.80 BSC
7.20
BSC SQ
10 9 8 7 6 5 4 3 2 1
TOP VIEW
BALL A1
PAD CORNER
DETAIL A
1.40 MAX
0.65 MIN
A
1 CORNER
INDEX AREA
9.10
9.00 SQ
8.90
COMPLIANT TO JEDEC STANDARDS MO-205-AB. 012006-0
Figure 56. 100-Lead Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9974BBCZ
1
−25°C to +85°C 100-Lead Chip Scale Package Ball Grid Array [CSP_BGA] BC-100-1
AD9974BBCZRL
1
−25°C to +85°C 100-Lead Chip Scale Package Ball Grid Array [CSP_BGA] BC-100-1
1
Z = RoHS Compliant Part.