Datasheet
AD9959
Rev. B | Page 44 of 44
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2
061008-A
PIN 1
INDICATOR
TOP
VIEW
7.75
BSC SQ
8.00
BSC SQ
1
56
14
15
43
42
28
29
6.25
6.10 SQ
5.95
0.50
0.40
0.30
0.30
0.23
0.18
0.50 BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0
.85
0
.80
6.50
REF
SEATING
PLANE
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
COPLANARITY
0.08
0.05 MAX
0.02 NOM
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
THE EXPOSED EPAD ON BOTTOM SIDE
OF PACKAGE IS AN ELECTRICAL
CONNECTION AND MUST BE
SOLDERED TO GROUND.
Figure 50. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
8 mm × 8 mm Body, Very Thin Quad
(CP-56-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9959BCPZ
1
–40°C to +85°C 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-56-1
AD9959BCPZ-REEL7
1
–40°C to +85°C 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-56-1
AD9959/PCBZ
1
Evaluation Board
1
Z = RoHS Compliant Part.
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registered trademarks are the property of their respective owners.
D05246-0-7/08(B)