Datasheet

AD9913
Rev. A | Page 32 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
011708-A
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDI
C
ATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 36. 32-Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9913BCPZ –40°C to +85°C 32-Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
AD9913BCPZ-REEL7 –40°C to +85°C 32-Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-2
AD9913/PCBZ Evaluation Board
1
Z = RoHS Compliant Part.
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D07002-0-6/10(A)