Inc. Recording Equipment User Manual
Table Of Contents
- Features
- Applications
- General Description
- Basic Block Diagram
- Revision History
- Specifications
- Absolute Maximum Ratings
- Pin Configuration and Function Descriptions
- Typical Performance Characteristics
- Input/Output Termination Recommendations
- Theory of Operation
- Thermal Performance
- Power-Up
- Power Supply Partitioning
- Serial Control Port
- I/O Register Map
- I/O Register Descriptions
- Serial Port Configuration (Register 0x0000 to Register 0x0005)
- Power-Down and Reset (Register 0x0010 to Register 0x0013)
- System Clock (Register 0x0020 to Register 0x0022)
- CMOS Output Divider (S-Divider) (Register 0x0100 to Register 0x0106)
- Frequency Tuning Word (Register 0x01A0 to Register 0x01AD)
- Register 0x01A0 to Register 0x01A5—Reserved
- Register 0x01A6—FTW0 (Frequency Tuning Word)
- Register 0x01A7—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01A8—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01A9—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01AA—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01AB—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01AC—Phase
- Register 0x01AD—Phase (Continued)
- Doubler and Output Drivers (Register 0x0200 to Register 0x0201)
- Calibration (User-Accessible Trim) (Register 0x0400 to Register 0x0410)
- Harmonic Spur Reduction (Register 0x0500 to Register 0x0509)
- Outline Dimensions
AD9912
Rev. D | Page 7 of 40
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Analog Supply Voltage (AVDD) 2 V
Digital Supply Voltage (DVDD) 2 V
Digital I/O Supply Voltage
(DVDD_I/O)
3.6 V
DAC Supply Voltage (AVDD3 Pins) 3.6 V
Maximum Digital Input Voltage −0.5 V to DVDD_I/O + 0.5 V
Storage Temperature −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JB
θ
JC
Unit
64-Lead LFCSP 25.2 13.9 1.7 °C/W typical
Note that the exposed pad on the bottom of package must be
soldered to ground to achieve the specified thermal performance.
See the Typical Performance Characteristics section for more
information.
ESD CAUTION