Inc. Recording Equipment User Manual
Table Of Contents
- Features
- Applications
- General Description
- Basic Block Diagram
- Revision History
- Specifications
- Absolute Maximum Ratings
- Pin Configuration and Function Descriptions
- Typical Performance Characteristics
- Input/Output Termination Recommendations
- Theory of Operation
- Thermal Performance
- Power-Up
- Power Supply Partitioning
- Serial Control Port
- I/O Register Map
- I/O Register Descriptions
- Serial Port Configuration (Register 0x0000 to Register 0x0005)
- Power-Down and Reset (Register 0x0010 to Register 0x0013)
- System Clock (Register 0x0020 to Register 0x0022)
- CMOS Output Divider (S-Divider) (Register 0x0100 to Register 0x0106)
- Frequency Tuning Word (Register 0x01A0 to Register 0x01AD)
- Register 0x01A0 to Register 0x01A5—Reserved
- Register 0x01A6—FTW0 (Frequency Tuning Word)
- Register 0x01A7—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01A8—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01A9—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01AA—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01AB—FTW0 (Frequency Tuning Word) (Continued)
- Register 0x01AC—Phase
- Register 0x01AD—Phase (Continued)
- Doubler and Output Drivers (Register 0x0200 to Register 0x0201)
- Calibration (User-Accessible Trim) (Register 0x0400 to Register 0x0410)
- Harmonic Spur Reduction (Register 0x0500 to Register 0x0509)
- Outline Dimensions
AD9912
Rev. D | Page 38 of 40
OUTLINE DIMENSIONS
PIN 1
INDICATOR
TOP
VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50 BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60 MAX
*
4.85
4.70 SQ
4.55
EXPOSED PAD
(BOTTOM VIEW)
*
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
082908-B
SEATING
PLANE
PIN 1
INDICATOR
0.30
0.25
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 57. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
062209-A
0.25 MIN
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
5.36
5.21 SQ
5.06
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
TOPVIEW
EXPOSED
PAD
BOTTOMVIEW
9.10
9.00 SQ
8.90
8.85
8.75 SQ
8.65
Figure 58. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-7)
Dimensions shown in millimeters