Datasheet

AD9901
REV. B –3–
INPUT/OUTPUT EQUIVALENT CIRCUITS
(Based on DIP Pinouts)
TTL Input ECL Input Output
DIE LAYOUT AND MECHANICAL INFORMATION
REFERENCE IN (–V
S
)+V
S
(GND) OUTPUT
R
SET
GND (–V
S
)
+V
S
(GND)
OUTPUT
VCO IN (–V
S
)GND (VCO IN)
GND (VCO IN)
V
S
(–V
S
)
GND (–V
S
)
GND (REFERENCE IN)
GND (REFERENCE IN)
Die Dimensions . . . . . . . . . . . . . . . . . 63 × 118 × 16 (±2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 × 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –V
S
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil Aluminum; Ultrasonic Bonding
ORDERING GUIDE
Temperature Package Package
Model Ranges Descriptions Options
AD9901KQ 0°C to +70°C 14-Lead Cerdip Q-14
AD9901KP 0°C to +70°C 20-Lead Plastic Leaded Chip Carrier P-20A
AD9901TQ/883
1
–55°C to +125°C 14-Lead Cerdip Q-14
AD9901TE/883
1
–55°C to +125°C 20-Terminal Ceramic Leadless Chip Carrier E-20A
NOTE
1
For specifications, refer to Analog Devices Military Products Databook.
AD9901 BURN-IN CIRCUIT
(Based on DIP ECL Pinouts)
REG
V
MID
1kV
180V
DA3
DA2
V
MID
1kV
180V
50V
0.01mF
–V
S
(–5.2V)
AD9901
ECL HIGH
ECL LOW
DA2
ECL HIGH
ECL LOW
DA3
ALL RESISTORS 65%
ALL CAPACITORS 620%
ALL SUPPLY VOLTAGES 65%
V
MID
= –1.3V 65%
STATIC: DA2 = ECL HIGH; DA3 = ECL LOW
DYNAMIC: ECL HIGH
5/12
+5.0V
VCO/REF, INPUT
4/13
3/14
–5.2V
VCO/REF, INPUT
VCO/REF, INPUT
0.47V
REFERENCE
TTL MODE = GROUND
ECL MODE = V
S
(–5.2V)
R
SET
TTL MODE = +V
S
(+5.0V)
ECL MODE = GROUND