Datasheet

AD9889B
Rev. A | Page 12 of 12
*
COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
A
B
C
D
E
F
G
J
H
K
10 8 7 6
3
2
1
9
5
4
A
1 CORNER
INDEX AREA
TOP VIEW
BALL A1
PAD CORNER
DETAIL A
BOTTOM VIEW
0.75
REF
6.10
6.00 SQ
5.90
SEATING
PLANE
BALL DIAMETER
0.15 MIN
0.35
0.30
0.25
COPLANARITY
0.08 MAX
0.65 MIN
0.50
BSC
4.50
BSC SQ
*
1.40 MAX
010807-A
DETAIL A
Figure 7. 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
6 mm × 6 mm × 1.4 mm
(BC-76-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9889BBCPZ-80 −25°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-1
AD9889BBCPZ-165 −25°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-1
AD9889BBSTZ-80 −25°C to +85°C 80-Lead Low Profile Quad Flat Package [LQFP] ST-80-2
AD9889BBSTZ-165 −25°C to +85°C 80-Lead Low Profile Quad Flat Package [LQFP] ST-80-2
AD9889BBBCZ-80 −25°C to +85°C 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-76-1
AD9889BBBCZRL-80 −25°C to +85°C 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-76-1
AD9889B/PCBZ Evaluation Board
1
Z = RoHS Compliant Part.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2007–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06291-0-3/10(A)