Datasheet

AD9858
Rev. C | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Maximum Junction Temperature 150°C
AV
DD
4 V
DV
DD
4 V
CPV
DD
6 V
Digital Input Voltage Range −0.7 V to +V
DD
Digital Output Current 5 mA
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL PERFORMANCE
Table 3.
Symbol Description (Using a 2S2P Test Board) Value (°C/W)
θ
JA
Junction-to-ambient thermal resistance,
0.0 m/sec airflow per JEDEC JESD51-2
(still air)
19.8
θ
JMA
Junction-to-ambient thermal resistance,
1.0 m/sec airflow per JEDEC JESD51-6
(moving air)
15.6
θ
JMA
Junction-to-ambient thermal resistance,
2.0 m/sec airflow per JEDEC JESD51-6
(moving air)
14.6
θ
JB
Junction-to-board thermal resistance,
1.0 m/sec airflow per JEDEC JESD51-8
(moving air)
8.2
θ
JC
Junction-to-case thermal resistance
(die to heat sink) per MIL-STD-883,
Method 1012.1
0.6
Ψ
JT
Junction-to-top-of-package
characterization parameter, 0 m/sec
airflow per JEDEC JESD51-2 (still air)
0.15
The AD9858 is specified for a case temperature (T
CASE
). To ensure
that T
CASE
is not exceeded, an airflow source may be used.
To determine the junction temperature on the application
printed circuit board (PCB),
T
J
= T
CASE
+ (Ψ
JT
× PD)
where:
T
J
is the junction temperature (°C).
T
CASE
is the case temperature (°C) measured by the customer at
the top center of package.
Ψ
JT
is found in Table 3.
PD is the power dissipation (see the total power dissipation in
Table 1).
Valu e s of θ
JA
are provided for package comparison and
PCB design considerations. θ
JA
can be used for a first-order
approximation of T
J
by the equation
T
J
= T
A
+ (θ
JA
× PD)
where T
A
is the ambient temperature (°C).
Valu e s of θ
JB
are provided for package comparison and PCB
design considerations (see Tabl e 3).
Valu e s of θ
JC
are provided for package comparison and PCB
design considerations when an external heat sink is required
(see Table 3).
EXPLANATION OF TEST LEVELS
I. 100% production tested.
III. Sample tested only.
IV. Parameter is guaranteed by design and characterization
testing.
V. Parameter is a typical value only.
VI. Devices are 100% production tested at 25°C and guaranteed
by design and characterization testing for industrial
operating temperature range.
ESD CAUTION