Datasheet

AD9858
Rev. C | Page 29 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
021809-A
1
25
26 50
76100
75
51
14.00 BSC SQ
16.00 BSC SQ
0.27
0.22
0.17
0.50 BSC
1.05
1.00
0.95
0.15
0.05
0.75
0.60
0.45
SEATING
PLANE
1.20
MAX
1
25
2650
76 100
75
51
6.50
NOM
7°
3.5°
0°
COPLANARITY
0.08
0.20
0.09
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
CONDUCTIVE
HEAT SINK
PIN 1
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 40. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
WARNING
The TQFP_EP (thermal slug) must be attached to the ground plane or some other large metal mass for thermal transfer. Failure to do so
may cause excessive die temperature rise and damage to the device.
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9858BSV –40°C to +85°C 100-Lead TQFP_EP SV-100-1
AD9858BSVZ
1
–40°C to +85°C 100-Lead TQFP_EP SV-100-1
AD9858/PCBZ
1
Generic Evaluation Board
AD9858/FDPCB Fractional Divide Evaluation Board
AD9858/TLPCBZ
1
Translation Loop Evaluation Board
1
Z = RoHS Compliant Part.