Datasheet

AD9838
Rev. A | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
AVDD to AGND −0.3 V to +6 V
DVDD to DGND −0.3 V to +6 V
AVDD to DVDD −0.3 V to +0.3 V
AGND to DGND −0.3 V to +0.3 V
CAP/2.5V 2.75 V
Digital I/O Voltage to DGND −0.3 V to DVDD + 0.3 V
Analog I/O Voltage to AGND −0.3 V to AVDD + 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature 220°C
Reflow Soldering (Pb Free)
Peak Temperature 260°C (+0/−5)
Time at Peak Temperature 10 sec to 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
20-Lead LFCSP_WQ (CP-20-10) 49.5 5.3 °C/W
ESD CAUTION