Datasheet

Data Sheet AD9837
Rev. A | Page 5 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
VDD to AGND −0.3 V to +6 V
VDD to DGND −0.3 V to +6 V
AGND to DGND −0.3 V to +0.3 V
CAP/2.5V 2.75 V
Digital I/O Voltage to DGND −0.3 V to VDD + 0.3 V
Analog I/O Voltage to AGND −0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature 220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
10-Lead LFCSP_WD (CP-10-9) 206 44 °C/W
ESD CAUTION