Datasheet

AD9786
Rev. B | Page 8 of 56
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter With Respect to Rating
AVDD1, AVDD2,
DRVDD
AGND1, AGND2,
ACGND, ADGND,
CLKGND, DGND
−0.3 V to +3.6 V
ACVDD, ADVDD,
CLKVDD, DVDD
AGND1, AGND2,
ACGND, ADGND,
CLKGND, DGND
−0.3 V to +2.8 V
AGND1, AGND2,
ACGND, ADGND,
CLKGND, DGND
AGND1, AGND2,
ACGND, ADGND,
CLKGND, DGND
−0.3 V to +0.3 V
REFIO, FSADJ AGND1 −0.3 to AVDD1 + 0.3
IOUTA, IOUTB AGND1 −1.0 to AVDD1 +0.3
P1B15 to P1B0,
P2B15 to P2B0, RESET
DGND −0.3 to DRVDD + 0.3
DATACLK DGND −0.3 to DRVDD + 0.3
CLK+, CLK− CLKGND −0.3 to CLKVDD + 0.3
CSB, SCLK,
SDIO, SDO
DGND −0.3 to DRVDD + 0.3
Junction
Temperature Range
−65°C to +125°C
Storage
Temperature
150°C
Lead Temperature
(10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
1
θ
JA
Unit
80-lead TQFP_EP (Thermally Enhanced) 23.5 °C/W
`
1
With thermal pad soldered to PCB.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product
features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to
high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality.