Datasheet

AD9785/AD9787/AD9788
Rev. A | Page 62 of 64
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HDT
1
25
26 50
76100
75
51
14.00 BSC SQ
16.00 BSC SQ
0.27
0.22
0.17
0.50 BSC
1.05
1.00
0.95
0.15
0.05
0.75
0.60
0.45
SEATING
PLANE
1.20
MAX
1
25
2650
76 100
75
51
6.50
NOM
7°
3.5°
0°
COPLANARITY
0.08
0.20
0.09
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
CONDUCTIVE
HEAT SINK
PIN 1
121207-A
NOTES:
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2
. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION
OF THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LO
C
ATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE,
WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
3
. θ
JA
: 27.4°C/W WITH THERMAL PAD UNSOLDERED, 19.1°C/W WITH THERMAL PAD SOLDERED TO PCB.
Figure 87. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9785BSVZ
1
−40C to +85C
100-Lead TQFP_EP SV-100-1
AD9785BSVZRL
1
−40C to +85C
100-Lead TQFP_EP SV-100-1
AD9787BSVZ
1
−40C to +85C
100-Lead TQFP_EP SV-100-1
AD9787BSVZRL
1
−40C to +85C
100-Lead TQFP_EP SV-100-1
AD9788BSVZ
1
−40C to +85C
100-Lead TQFP_EP SV-100-1
AD9788BSVZRL
1
−40C to +85C
100-Lead TQFP_EP SV-100-1
AD9785-EBZ
1
Evaluation Board
AD9787-EBZ
1
Evaluation Board
AD9788-EBZ
1
Evaluation Board
1
RoHS Compliant Part.