Datasheet

AD9785/AD9787/AD9788
Rev. A | Page 6 of 64
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
AVDD33 to AGND, DGND, CGND −0.3 V to +3.6 V
DVDD33, DVDD18, CVDD18
to AGND, DGND, CGND
−0.3 V to +2.1 V
AGND to DGND, CGND −0.3 V to +0.3 V
DGND to AGND, CGND −0.3 V to +0.3 V
CGND to AGND, DGND −0.3 V to +0.3 V
I120, VREF, IPTAT to AGND −0.3 V to AVDD33 + 0.3 V
OUT1_P, OUT1_N, OUT2_P, OUT2_N,
AUX1_P, AUX1_N, AUX2_P,
AUX2_N to AGND
−1.0 V to AVDD33 + 0.3 V
P1D[15] to P1D[0], P2D[15] to P2D[0]
to DGND
−0.3 V to DVDD33 + 0.3 V
DATACLK, TXENABLE to DGND −0.3 V to DVDD33 + 0.3 V
REFCLK+, REFCLK−, RESET, IRQ,
PLL_LOCK, SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I− to CGND
−0.3 V to CVDD18 + 0.3 V
RESET, IRQ, PLL_LOCK, SYNC_O+,
SYNC_O−, SYNC_I+, SYNC_I−,
SPI_CSB, SCLK, SPI_SDIO, SPI_SDO
to DGND
−0.3 V to DVDD33 + 0.3 V
Junction Temperature 125°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
For this 100-lead, thermally enhanced TQFP, the exposed paddle
(EPAD) must be soldered to the ground plane. Note that these
specifications are valid with no airflow movement.
Table 5. Thermal Resistance
Resistance Unit Conditions
θ
JA
19.1°C/W EPAD soldered. No airflow.
θ
JB
12.4°C/W EPAD soldered. No airflow.
θ
JC
7.1°C/W EPAD soldered. No airflow.
ESD CAUTION