Datasheet

Data Sheet AD9780/AD9781/AD9783
Rev. B | Page 31 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
0.20 REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
1
18
54
37
19
36
72
55
0.50
0.40
0.30
8.50 REF
4.70
BSC SQ
PIN 1
INDICATOR
SEATING
PLANE
12° MAX
0.60
0.42
0.24
0.60
0.42
0.24
0.30
0.23
0.18
0.50
BSC
PIN 1
INDICATOR
COPLANARITY
0.08
06-07-2012-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
TOP VIEW
EXPOSED
PAD
(BOTTOM VIEW)
10.10
10.00 SQ
9.90
9.85
9.75 SQ
9.65
Figure 74. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
10 mm × 10 mm, Very Thin Quad
(CP-72-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9780BCPZ −40°C to +85°C 72-Lead LFCSP_VQ CP-72-1
AD9780BCPZRL −40°C to +85°C 72-Lead LFCSP_VQ CP-72-1
AD9781BCPZ −40°C to +85°C 72-Lead LFCSP_VQ CP-72-1
AD9781BCPZRL −40°C to +85°C 72-Lead LFCSP_VQ CP-72-1
AD9783BCPZ −40°C to +85°C 72-Lead LFCSP_VQ CP-72-1
AD9783BCPZRL −40°C to +85°C 72-Lead LFCSP_VQ CP-72-1
AD9783-DPG2-EBZ Evaluation Board
1
Z = RoHS Compliant Part.