Datasheet

AD9780/AD9781/AD9783 Data Sheet
Rev. B | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
With
Respect to Rating
AVDD33, DVDD33 AGND, DGND, CGND −0.3 V to +3.6 V
DVDD18, CVDD18 AGND, DGND, CGND −0.3 V to +1.98 V
AGND DGND, CGND −0.3 V to +0.3 V
DGND AGND, CGND −0.3 V to +0.3 V
CGND AGND, DGND −0.3 V to +0.3 V
REFIO
AGND
−0.3 V to
AVDD33 + 0.3 V
IOUT1P, IOUT1N,
IOUT2P, IOUT2N,
AUX1P, AUX1N,
AUX2P, AUX2N
AGND −1.0 V to
AVDD33 + 0.3 V
D15 to D0
DGND
−0.3 V to
DVDD33 + 0.3 V
CLKP, CLKN CGND −0.3 V to
CVDD18 + 0.3 V
CSB, SCLK, SDIO, SDO DGND –0.3 V to
DVDD33 + 0.3 V
Junction Temperature +125°C
Storage Temperature −65°C to +150°C
THERMAL RESISTANCE
Thermal resistance is tested using a JEDEC standard 4-layer
thermal test board with no airflow.
Table 5.
Package Type θ
JA
Unit
CP-72-1 (Exposed Pad Soldered to PCB) 25 °C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION