Datasheet

AD9776/AD9778/AD9779
Rev. A | Page 8 of 56
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
With
Respect
To
Rating
AVDD33, DVDD33
AGND,
DGND,
CGND
−0.3 V to +3.6 V
DVDD18, CVDD18
AGND,
DGND,
CGND
−0.3 V to +1.98 V
AGND
DGND,
CGND
−0.3 V to +0.3 V
DGND
AGND,
CGND
−0.3 V to +0.3 V
CGND
AGND,
DGND
−0.3 V to +0.3 V
I120, VREF, IPTAT AGND −0.3 V to AVDD33 + 0.3 V
I
OUT1-P
, I
OUT1-N
, I
OUT2-P
,
I
OUT2-N
, Aux
1-P
, Aux
1-N
,
Aux
2-P
, Aux
2-N
AGND −1.0 V to AVDD33 + 0.3 V
P1D15 to P1D0,
P2D15 to P2D0
DGND −0.3 V to DVDD33 + 0.3 V
DATACLK, TXENABLE DGND −0.3 V to DVDD33 + 0.3 V
CLK+, CLK− CGND −0.3 V to CVDD18 + 0.3 V
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I−,
CSB, SCLK, SDIO, SDO
DGND −0.3 V to DVDD33 + 0.3 V
Junction Temperature +125°C
Storage Temperature
Range
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
100-lead, thermally enhanced TQFP_EP package, θ
JA
= 19.1°C/W
with the bottom EPAD soldered to the PCB. With the bottom
EPAD not soldered to the PCB, θ
JA
= 27.4°C/W. These
specifications are valid with no airflow movement.
ESD CAUTION