Datasheet

AD9776/AD9778/AD9779
Rev. A | Page 56 of 56
OUTLINE DIMENSIONS
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2
. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION O
F
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNA
L
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIV
E
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
1
25
26 50
76100
75
51
14.00 BSC SQ
16.00 BSC SQ
0.27
0.22
0.17
0.50 BSC
1.05
1.00
0.95
0.15
0.05
0.75
0.60
0.45
SEATING
PLANE
1.20
MAX
1
25
2650
76 100
75
51
6.50
NOM
7°
3.5°
0°
COPLANARITY
0.08
0.20
0.09
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
CONDUCTIVE
HEAT SINK
PIN 1
Figure 116. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9776BSVZ
1
−40°C to +85°C
100-lead TQFP_EP SV-100-1
AD9776BSVZRL
1
−40°C to +85°C
100-lead TQFP_EP SV-100-1
AD9778BSVZ
1
−40°C to +85°C
100-lead TQFP_EP SV-100-1
AD9778BSVZRL
1
−40°C to +85°C
100-lead TQFP_EP SV-100-1
AD9779BSVZ
1
−40°C to +85°C
100-lead TQFP_EP SV-100-1
AD9779BSVZRL
1
−40°C to +85°C
100-lead TQFP_EP SV-100-1
AD9776-EB Evaluation Board
AD9778-EB Evaluation Board
AD9779-EBZ
1
Evaluation Board
1
Z = RoHS Compliant Part.
©2005–2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05361-0-3/07(A)