Datasheet

AD9777
Rev. C | Page 9 of 60
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter With Respect To Min Max Unit
AVDD, DVDD, CLKVDD AGND, DGND, CLKGND −0.3 +4.0 V
AVDD, DVDD, CLKVDD AVDD, DVDD, CLKVDD −4.0 +4.0 V
AGND, DGND, CLKGND AGND, DGND, CLKGND −0.3 +0.3 V
REFIO, FSADJ1/FSADJ2 AGND −0.3 AVDD + 0.3 V
I
OUTA
, I
OUTB
AGND −1.0 AVDD + 0.3 V
P1B15 to P1B0, P2B15 to P2B0, RESET DGND −0.3 DVDD + 0.3 V
DATACLK/PLL_LOCK DGND −0.3 DVDD + 0.3 V
CLK+, CLK− CLKGND −0.3 CLKVDD + 0.3 V
LPF CLKGND −0.3 CLKVDD + 0.3 V
SPI_CSB, SPI_CLK, SPI_SDIO, SPI_SDO DGND −0.3 DVDD + 0.3 V
Junction Temperature 125 °C
Storage Temperature −65 +150 °C
Lead Temperature (10 sec) 300 °C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
80-lead thin quad flat package, exposed pad [TQFP_EP]
θ
JA
= 23.5°C/W (With thermal pad soldered to PCB)
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.