Datasheet

AD9773
Rev. D | Page 9 of 60
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter With Respect To Min Max Unit
AVDD, DVDD, CLKVDD AGND, DGND, CLKGND −0.3 +4.0 V
AVDD, DVDD, CLKVDD AVDD, DVDD, CLKVDD −4.0 +4.0 V
AGND, DGND, CLKGND AGND, DGND, CLKGND −0.3 +0.3 V
REFIO, FSADJ1/FSADJ2 AGND −0.3 AVDD + 0.3 V
I
OUTA
, I
OUTB
AGND −1.0 AVDD + 0.3 V
P1B11 to P1B0, P2B11 to P2B0, RESET DGND −0.3 DVDD + 0.3 V
DATACLK, PLL_LOCK DGND −0.3 DVDD + 0.3 V
CLK+, CLK− CLKGND −0.3 CLKVDD + 0.3 V
LPF CLKGND −0.3 CLKVDD + 0.3 V
SPI_CSB, SPI_CLK, SPI_SDIO, SPI_SDO DGND −0.3 DVDD + 0.3 V
Junction Temperature 125 °C
Storage Temperature −65 +150 °C
Lead Temperature (10 sec) 300 °C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum ratings for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
80-lead thin quad flat package, exposed pad (TQFP_EP)
θ
JA
= 23.5°C/W (with thermal pad soldered to PCB)
ESD CAUTION