Datasheet

AD9772A
Rev. C | Page 9 of 40
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter With Respect to Rating
AVDD, DVDD, CLKVDD,
PLLVDD
ACOM, DCOM,
CLKCOM, PLLCOM
−0.3 V to +4.0 V
AVDD, DVDD, CLKVDD,
PLLVDD
AVDD, DVDD,
CLKVDD, PLLVDD
−4.0 V to +4.0 V
ACOM, DCOM,
CLKCOM, PLLCOM
ACOM, DCOM,
CLKCOM, PLLCOM
−0.3 V to +0.3 V
REFIO, REFLO, FSADJ,
SLEEP
ACOM
−0.3 V to
AVDD + 0.3 V
I
OUTA
, I
OUTB
ACOM
−1.0 V to
AVDD + 0.3 V
DB0 to DB13, MOD0,
MOD1, PLLLOCK
DCOM
−0.3 V to
DVDD + 0.3 V
CLK+, CLK− CLKCOM
−0.3 V to
CLKVDD + 0.3 V
DIV0, DIV1, RESET CLKCOM
−0.3 V to
CLKVDD + 0.3 V
LPF PLLCOM
−0.3 V to
PLLVDD + 0.3 V
Junction Temperature 125°C
Storage Temperature −65°C to +150°C
Lead Temperature
(10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
48-Lead LQFP 91 28 °C/W
ESD CAUTION