Datasheet

AD9760
–23–
REV. B
28-Lead, 300 Mil SOIC
(R-28)
SEATING
PLANE
0.0118 (0.30)
0.0040 (0.10)
0.0192 (0.49)
0.0138 (0.35)
0.1043 (2.65)
0.0926 (2.35)
0.0500
(1.27)
BSC
0.7125 (18.10)
0.6969 (17.70)
0.4193 (10.65)
0.3937 (10.00)
0.2992 (7.60)
0.2914 (7.40)
PIN 1
28 15
141
0.0125 (0.32)
0.0091 (0.23)
0.0500 (1.27)
0.0157 (0.40)
8ⴗ
0ⴗ
0.0291 (0.74)
0.0098 (0.25)
ⴛ 45ⴗ
28-Lead Thin Shrink Small Outline Package (TSSOP)
(RU-28)
28
15
14
1
0.386 (9.80)
0.378 (9.60)
0.256 (6.50) 0.246 (6.25)
0.177 (4.50) 0.169 (4.30)
PIN 1
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
0.0433
(1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8ⴗ
0ⴗ
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
C2200b–1–3/00 (rev. B)
PRINTED IN U.S.A.