Datasheet

AD9742 Data Sheet
Rev. C | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
With
Respect to Min Max Unit
AVDD ACOM −0.3 +3.9 V
DVDD DCOM −0.3 +3.9 V
CLKVDD CLKCOM −0.3 +3.9 V
ACOM DCOM −0.3 +0.3 V
ACOM CLKCOM −0.3 +0.3 V
DCOM
CLKCOM
−0.3
+0.3
V
AVDD DVDD −3.9 +3.9 V
AVDD CLKVDD −3.9 +3.9 V
DVDD CLKVDD −3.9 +3.9 V
CLOCK, SLEEP DCOM −0.3 DVDD + 0.3 V
Digital Inputs, MODE DCOM −0.3 DVDD + 0.3 V
IOUTA, IOUTB ACOM −1.0 AVDD + 0.3 V
REFIO, REFLO, FS ADJ ACOM −0.3 AVDD + 0.3 V
CLK+, CLK−, MODE CLKCOM −0.3 CLKVDD + 0.3 V
Junction Temperature 150 °C
Storage Temperature −65 +150 °C
Lead Temperature
(10 sec)
300 °C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Thermal impedance measurements were taken on a 4-layer
board in still air, in accordance with EIA/JESD51-7.
Table 5. Thermal Resistance
Package Type θ
JA
Unit
28-Lead SOIC 55.9 °C/W
28-Lead TSSOP
67.7
°C/W
32-Lead LFCSP
32.5
°C/W
ESD CAUTION