Datasheet

AD9742 Data Sheet
Rev. C | Page 30 of 32
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 57. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9742AR −40°C to +85°C 28-Lead Standard Small Outline Package [SOIC] RW-28
AD9742ARZ −40°C to +85°C 28-Lead Standard Small Outline Package [SOIC] RW-28
AD9742ARZRL −40°C to +85°C 28-Lead Standard Small Outline Package [SOIC] RW-28
AD9742ARU −40°C to +85°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
AD9742ARURL7 −40°C to +85°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
AD9742ARUZ −40°C to +85°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
AD9742ARUZRL7
−40°C to +85°C
28-Lead Thin Shrink Small Outline Package [TSSOP]
RU-28
AD9742ACPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
AD9742ACPZRL7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
AD9742-EBZ Evaluation Board [SOIC]
AD9742ACP-PCBZ Evaluation Board [LFCSP]
1
Z = RoHS Compliant Part.