Datasheet

AD9740
Rev. B | Page 7 of 32
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
With
Respect to
Min Max Unit
AVDD ACOM −0.3 +3.9 V
DVDD DCOM −0.3 +3.9 V
CLKVDD CLKCOM −0.3 +3.9 V
ACOM DCOM −0.3 +0.3 V
ACOM CLKCOM −0.3 +0.3 V
DCOM CLKCOM −0.3 +0.3 V
AVDD DVDD −3.9 +3.9 V
AVDD CLKVDD −3.9 +3.9 V
DVDD CLKVDD −3.9 +3.9 V
CLOCK, SLEEP DCOM −0.3 DVDD + 0.3 V
Digital Inputs, MODE DCOM −0.3 DVDD + 0.3 V
IOUTA, IOUTB ACOM −1.0 AVDD + 0.3 V
REFIO, REFLO, FS ADJ ACOM −0.3 AVDD + 0.3 V
CLK+, CLK−, MODE CLKCOM −0.3 CLKVDD + 0.3 V
Junction
Temperature
150 °C
Storage
Temperature
Range
−65 +150 °C
Lead Temperature
(10 sec)
300 °C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum ratings for extended periods may effect
device reliability.
THERMAL CHARACTERISTICS
1
Thermal Resistance
28-Lead 300-Mil SOIC
θ
JA
= 55.9°C/W
28-Lead TSSOP
θ
JA
= 67.7°C/W
32-Lead LFCSP
θ
JA
= 32.5°C/W
1
Thermal impedance measurements were taken on a 4-layer board in still air,
in accordance with EIA/JESD51-7.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.