Datasheet

Data Sheet AD9737A/AD9739A
Rev. C | Page 63 of 64
OUTLINE DIMENSIONS
12.10
12.00 SQ
11.90
0.43 MAX
0.25 MIN
1.00 MAX
0.85 MIN
A
B
C
D
E
F
G
H
J
K
L
M
N
P
14
13
12
11
10 8
7
6
3
2
19
5
4
1.40 MAX
0.55
0.50
0.45
10.40
BSC SQ
11-18-2011-A
COMPLIANT WITH JEDEC STANDARDS MO-275-GGAA-1.
COPLANARITY
0.12
BALL DIAMETER
0.80
BSC
DETAIL A
A1 BALL
CORNER
A1 BALL
CORNER
DETAIL A
BOTTOM VIEW
TOP VIEW
SEATING
PLANE
Figure 189. 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-160-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9737ABBCZ −40°C to +85°C 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-160-1
AD9737ABBCZRL −40°C to +85°C 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-160-1
AD9737A-EBZ Evaluation Board for Normal, CMTS, and Mix-Mode Evaluation
AD9739ABBCZ −40°C to +85°C 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-160-1
AD9739ABBCZRL −40°C to +85°C 160- Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-160-1
AD9739A-EBZ Evaluation Board for Normal, CMTS, and Mix-Mode Evaluation
AD9739A-FMC-EBZ
Evaluation Board with FMC connector for Xilinx based FPGA
development platforms
1
Z = RoHS Compliant Part.