Datasheet

AD9734/AD9735/AD9736
Rev. A | Page 69 of 72
OUTLINE DIMENSIONS
12.10
12.00 SQ
11.90
SEATING
PLANE
0.43 MAX
0.25 MIN
DETAIL A
0.55
0.50
0.45
0.12 MAX
COPLANARITY
1.00 MAX
0.85 MIN
BALL DIAMETER
0.80 BSC
0.80
REF
10.40
BSC SQ
A
B
C
D
E
F
G
H
J
K
L
M
N
P
14
13
12
11
10 8
7
6
3
2
1
95
4
A
1 CORNE
R
INDEX AREA
TOP VIEW
BALL A1
INDICATOR
DETAIL A
BOTTOM
VIEW
1.40 MAX
COMPLIANT TO JEDEC STANDARDS MO-205-AE.
Figure 116. 160-Lead Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-160-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9734BBC −40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9734BBCRL −40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9734BBCZ
1
−40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9734BBCZRL
1
−40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9735BBC −40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9735BBCZ
1
−40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9735BBCRL −40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9735BBCZRL
1
−40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9736BBC −40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9736BBCRL −40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9736BBCZ
1
−40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9736BBCZRL
1
−40°C to +85°C 160-Lead Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-1
AD9734-EB Evaluation Board
AD9735-EB Evaluation Board
AD9736-EB Evaluation Board
1
Z = Pb-free part.