Datasheet

AD9734/AD9735/AD9736
Rev. A | Page 68 of 72
04862-113
NOTES 1. MATERIAL: FOUR LAYER, FR4 GLASS–EPOXY LAMINATE
.062 +/- .007 THICK 1/4 OZ. COPPER CLAD – EXTERNAL LAYERS
PLATED TO 1 OUNCE
2 OZ. COPPER CLAD – INTERNAL LAYERS
2. PLATED THRU HOLES AND THE CONDUCTIVE PATTERN
ELECTROPLATED WITH .001 INCH MIN. THICK COPPER. TERMINAL AREAS AND EXPOSED PLATED THRU HOLES TO B
E
COATED WITH SOLDER AND HOT AIR LEVELED.
3. PROCESSING TOLERANCES:
A. CONDUCTIVE PATTERN FRON TO BACK REGISTRATION
+/– .002 INCH TOTAL
B. MINIMUM ANNULAR RING SURROUNDING HOLES .002 INCH. C. FINISHED CONDUCTIVE PATTERN +/– .0005 INCH
OF APERTURE SIZE.
4. WARP AND TWIST +/– .005 INCH PER INCH. 5. DIMENTIONS: ARE FOR THE FINISHED PART 6. SOLDER MASK: LIQUID PHOTO IMAGABLE SOLDER MASK
COLOR GREEN, BOTH SIDES USING THE PATTERN(S) PROVIDED. NO MASK IS PERMITTED ON THE EXPOSED AREAS. SOLDER MASK TO ETCH REGISTRATION +/– .002 INCH TOTAL
7. SCREENING: SCREEN COMPONENT OUTLINES AND
NOMENCLATURE USING OPAQUE WHITE INK ON THE PRIMARY AND SECONDARY SIDES (AS REQUIRED). NOMENCLATURE SHALL BE LEGIBLE. SCREEN TO ETCH REGISTRATION +/– .005 INCH TOTAL.
8. SURFACES: PUNCHED OR MACHINED SURFACES 125 MICRO
INCHES RMS MAX.
9. BREAK ALL SHARP EDGES .015 R MAX. 10. FABRICATION VENDOR TO ADD UL VENDOR ID NUMBER
IN THIS AREA ON THE SECONDARY SIDE
11. DO NOT DRILL. FOR GOLD PLATED SOCKETED VERSION ONLY.
Figure 115. PCB Fabrication Detail, AD973x Evaluation Board, Rev. F