Datasheet

Data Sheet AD9704/AD9705/AD9706/AD9707
Rev. B | Page 11 of 44
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter Rating
AVDD to ACOM −0.3 V to +3.9 V
DVDD to DCOM −0.3 V to +3.9 V
CLKVDD to CLKCOM −0.3 V to +3.9 V
ACOM to DCOM −0.3 V to +0.3 V
ACOM to CLKCOM −0.3 V to +0.3 V
DCOM to CLKCOM −0.3 V to +0.3 V
AVDD to DVDD −3.9 V to +3.9 V
AVDD to CLKVDD −3.9 V to +3.9 V
DVDD to CLKVDD −3.9 V to +3.9 V
SLEEP to DCOM −0.3 V to DVDD + 0.3 V
Digital Inputs, MODE to DCOM −0.3 V to DVDD + 0.3 V
IOUTA, IOUTB to ACOM −1.0 V to AVDD + 0.3 V
REFIO, FS ADJ, OTCM to ACOM −0.3 V to AVDD + 0.3 V
CLK+, CLK–, CMODE to CLKCOM −0.3 V to CLKVDD + 0.3 V
Junction Temperature 150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (10 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Thermal impedance measurements were taken on a 4-layer board
in still air, in accordance with EIA/JESD51-7.
Table 8. Thermal Resistance
Package Type θ
JA
Unit
32-Lead LFCSP_VQ 32.5 °C/W
ESD CAUTION