Datasheet

Data Sheet AD9637
Rev. A | Page 37 of 40
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
0.25 MIN
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
6.35
6.20 SQ
6.05
PIN 1
INDICATOR
0.30
0.25
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
9.10
9.00 SQ
8.90
8.85
8.75 SQ
8.65
06-12-2012-C
Figure 62. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9637BCPZ-40 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-4
AD9637BCPZRL7-40 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-4
AD9637BCPZ-80 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-4
AD9637BCPZRL7-80 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-4
AD9637-80EBZ Evaluation Board
1
Z = RoHS Compliant Part.