Datasheet

AD9634
Rev. 0 | Page 9 of 32
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 6.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V
DRVDD to AGND −0.3 V to +2.0 V
VIN+, VIN− to AGND −0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND −0.3 V to AVDD + 0.2V
VCM to AGND −0.3 V to AVDD + 0.2 V
CSB to AGND −0.3 V to DRVDD + 0.3 V
SCLK to AGND −0.3 V to DRVDD + 0.3 V
SDIO to AGND −0.3 V to DRVDD + 0.3 V
D0±/D1± through D10±/D11±
to AGND
−0.3 V to DRVDD + 0.3 V
DCO+/DCO− to AGND −0.3 V to DRVDD + 0.3 V
OR+/OR− to AGND −0.3 V to DRVDD + 0.3 V
Environmental
Operating Temperature Range
(Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
−65°C to +125°C
The exposed paddle must be soldered to the ground plane for the
LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints, maximizing
the thermal capability of the package.
Table 7. Thermal Resistance
Package
Type
Airflow
Velocity
(m/sec) θ
JA
1, 2
θ
JC
1, 3
θ
JB
1, 4
Unit
0 37.1 3.1 20.7 °C/W
1.0 32.4 °C/W
32-Lead LFCSP
5 mm × 5 mm
(CP-32-12)
2.0 29.1 °C/W
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
Typical θ
JA
is specified for a 4-layer PCB with solid ground plane.
As shown in Table 7, airflow increases heat dissipation, which
reduces θ
JA
. In addition, metal in direct contact with the package
leads from metal traces, through holes, ground, and power
planes reduces the θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION