Datasheet
AD9609
Rev. 0 | Page 32 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.65
3.50 SQ
3.35
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
100608-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 55. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad (CP-32-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9609BCPZ-80
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD9609BCPZRL7-80
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD9609BCPZ-65
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD9609BCPZRL7-65
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD9609BCPZ-40
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD9609BCPZRL7-40
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD9609BCPZ-20
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD9609BCPZRL7-20
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-4
AD9609-80EBZ
1
Evaluation Board
AD9609-65EBZ
1
Evaluation Board
AD9609-40EBZ
1
Evaluation Board
AD9609-20EBZ
1
Evaluation Board
1
Z = RoHS Compliant Part.
2
The exposed paddle (Pin 0) is the only GND connection on the chip and must be connected to the PCB AGND.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08541-0-10/09(0)