Datasheet

AD9572
Rev. B | Page 9 of 20
ABSOLUTE MAXIMUM RATINGS
Table 11.
Parameter Rating
VS to GND −0.3 V to +3.6 V
REFCLK to GND −0.3 V to VS + 0.3 V
BYPASSx to GND −0.3 V to VS + 0.3 V
XO to GND −0.3 V to VS + 0.3 V
FREQSEL, FORCE_LOW, and
REFSEL to GND
−0.3 V to VS + 0.3 V
25M, 33M, 100M/125M, 106M, and
156M to GND
−0.3 V to VS + 0.3 V
Junction Temperature
1
150°C
Storage Temperature Range −65°C to +150°C
1
See Table 12 for θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Thermal impedance measurements were taken on a 4-layer
board in still air in accordance with EIA/JESD51-7.
Table 12. Thermal Resistance
Package Type θ
JA
Unit
40-Lead LFCSP 27.5 °C/W
ESD CAUTION